Method for direct forming stressor, semiconductor device having stressor, and method for forming the same

ABSTRACT

A semiconductor device includes a semiconductor fin protruding from a substrate, a gate electrode over the semiconductor fin, a gate insulating layer between the semiconductor fin and the gate electrode, source and drain regions disposed on opposite sides of the semiconductor fin, a first stressor formed in a region between the source and drain regions. The first stressor is a grading strained stressor including multiple graded portions formed at graded depths. The first stressor is configured to create one of a graded compressive stress or a graded tensile stress.

This application claims priority of U.S. Provisional Application No.62/527,839 filed on Jun. 30, 2017, the entire contents of which areincorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates generally to a method for forming astressor, a semiconductor having a stressor, and a method for formingthe same, and more particularly, to a method for direct forming anano-stressor by an ion beam using a sacrificial layer, a semiconductorhaving a nano-stressor formed by an ion beam, and a method for formingthe same.

BACKGROUND

In semiconductor devices, strain engineering has been applied to improveelectron/hole mobility.

A contemporary method for forming stressors inside a semiconductormaterial usually requires an ion implantation mask, which furtherrequires a photolithography process, so as to control lateral locationsof stressors to be formed. In such a method, individual, independentcontrol of the stressors including the relative locations, depths,sizes, and doped concentrations thereof are not available, because thestressors are formed simultaneously by the same implantation. Control ofthe depth of the stressor from the surface (e.g., a top surface of thesubstrate) is currently performed by changing accelerating voltage ofthe ion beam used to form the strainer. The problem with changingaccelerating voltage of the ion beam is that the throughput can bedelayed because of the machine stabilization time.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a schematic cross-sectional view of a strained channeltransistor according to embodiments of the present disclosure.

FIG. 2 is a schematic cross-sectional view of a strained channeltransistor according to embodiments of the present disclosure.

FIG. 3A is conceptual view of implanting dopants or impurities atdesired depths into a region of interest in a substrate according toembodiments of the present disclosure.

FIG. 3B is conceptual view of implanting dopants or impurities atdesired depths into a region of interest in a substrate according toembodiments of the present disclosure.

FIG. 3C is conceptual view of implanting dopants or impurities atdesired depths into a region of interest in a substrate according toembodiments of the present disclosure.

FIG. 4 is a structure of a stressor manufactured by a method accordingto embodiments of the present disclosure and dimensions of the exemplarystructure.

FIG. 5A is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 1, according toembodiments of the present disclosure.

FIG. 5B is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 1, according toembodiments of the present disclosure.

FIG. 5C is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 1, according toembodiments of the present disclosure.

FIG. 5D is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 1, according toembodiments of the present disclosure.

FIG. 5E is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 1, according toembodiments of the present disclosure.

FIG. 5F is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 1, according toembodiments of the present disclosure.

FIG. 5G is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 1, according toembodiments of the present disclosure.

FIG. 5H is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 1, according toembodiments of the present disclosure.

FIG. 5I is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 1, according toembodiments of the present disclosure.

FIG. 5J is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 1, according toembodiments of the present disclosure.

FIG. 6A is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 2, according toembodiments of the present disclosure.

FIG. 6B is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 2, according toembodiments of the present disclosure.

FIG. 6C is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 2, according toembodiments of the present disclosure.

FIG. 6D is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 2, according toembodiments of the present disclosure.

FIG. 6E is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 2, according toembodiments of the present disclosure.

FIG. 6F is a process stage illustrating a process flow for manufacturingthe strained channel transistor shown in FIG. 2, according toembodiments of the present disclosure.

FIG. 7A is a process stage illustrating a process flow for manufacturingmultiple semiconductor nanowires (NWs) according to embodiments of thepresent disclosure.

FIG. 7B is a process stage illustrating a process flow for manufacturingmultiple semiconductor nanowires (NWs) according to embodiments of thepresent disclosure.

FIG. 7C is a process stage illustrating a process flow for manufacturingmultiple semiconductor nanowires (NWs) according to embodiments of thepresent disclosure.

FIG. 7D is a process stage illustrating a process flow for manufacturingmultiple semiconductor nanowires (NWs) according to embodiments of thepresent disclosure.

FIG. 7E is a process stage illustrating a process flow for manufacturingmultiple semiconductor nanowires (NWs) according to embodiments of thepresent disclosure.

FIG. 7F is a process stage illustrating a process flow for manufacturingmultiple semiconductor nanowires (NWs) according to embodiments of thepresent disclosure.

FIG. 8A is a transmission electron microscopy (TEM) image of an InAsnanowire formed on a silicon (111) substrate having a helium stressorembedded therein.

FIG. 8B is a transmission electron microscopy (TEM) image and adiffraction image of region R1 of FIG. 8A.

FIG. 8C is a transmission electron microscopy (TEM) image and adiffraction image of region R2 of FIG. 8A.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

In the entire disclosure, “about” used to describe a parameter meansthat design error/margin, manufacturing error/margin, measurement erroretc. are considered to define the parameter. Such a description shouldbe recognizable to one of ordinary skill in the art.

FIG. 1 is a schematic cross-sectional view of a strained channeltransistor 10 according to embodiments of the present disclosure.

Referring to FIG. 1, a strained channel transistor 10 is formed in asubstrate 100 which can be one of a silicon (Si) substrate, a germanium(Ge) substrate, a silicon germanium (SiGe) substrate, a gallium arsenide(GaAs) substrate, an indium gallium arsenide (InGaAs) substrate, and asilicon-on-insulator (SOI) substrate, although the present discourse isnot limited thereto. The strained channel transistor 10 includes achannel region 110 made of a fin structure protruding from the substrate100, and a gate structure including a gate insulating layer 131 and agate electrode layer 135. The gate insulating layer 131 includes sideportions covering side surfaces of the channel region 110 and includes atop surface connecting the side portions of the insulating layer 131.The gate electrode layer 135 includes side portions covering sidesurfaces of the gate insulating layer 131 and includes a top surfaceconnecting the side portions of the gate electrode layer 135. The gateinsulating layer 131 may include one or more layers of a dielectricmaterial, such as silicon oxide, silicon nitride, or high-k dielectricmaterial, other suitable dielectric material, and/or combinationsthereof. Examples of high-k dielectric material include HfO₂, HfSiO,HfSiON, HfTaO, HfTiO, HfZrO, zirconium oxide, aluminum oxide, titaniumoxide, hafnium dioxide-alumina (HfO₂—Al₂O₃) alloy, other suitable high-kdielectric materials, and/or combinations thereof. The material for thegate electrode layer 135 may be poly-Si, poly-Si with silicide, Al, Cu,W, Ti, Ta, TiN, TaN, TiW, WN, TiAl, TiAlN, TaC, TaCN and TiSiN, or anyother suitable materials.

In some embodiments, the channel region 110 is a portion of thesubstrate 100 by removing portions of the substrate 100 on oppositesides of the channel region 110 such that the remaining portion of thesubstrate 100 after the removal process becomes the fin structureprotruding from the substrate 100. In a case in which the substrate 100is an SOI substrate, the channel region 110 is formed of a device layerof the SOI substrate by removing portions of the device layer.Alternatively, the channel region 110 is made of an epitaxially grownsemiconductor layer including, but not limited to, a crystalline siliconlayer or a crystalline silicon germanium layer, on the substrate 100. Inthis case, one or more buffer layers (not shown) may be optionally grownon the substrate 100 prior to forming the epitaxially grownsemiconductor layer so as to alleviate interface defects caused, forexample, by a lattice mismatch. If necessary, portions of theepitaxially grown semiconductor layer can be removed to form the channelregion 110.

Referring to FIG. 1, the strained channel transistor 10 includes sourceand drain regions 141 and 142 made, for example, from portions of thesubstrate 100 heavily doped with dopants or impurities.

The strained channel transistor 10 further includes a graded firststressor 121 which has a first portion under the gate insulating layer13 and an extended portion at a larger depth between the source region141 and the channel region 110. The adjective “graded” in the context ofthe current disclosure refers to a state of having two or more elementsthat are at slightly different depths and lateral positions, such as thegraded first stressor 121. The first stressor 121 may not be locateddirectly below the channel region 110 in a thickness direction of thesubstrate 100. In some embodiments, the first stressor 121 containsdopants or impurities that are not contained in the region immediatelyadjacent to the first stressor 121. For example, the first stressor 121contains the dopants or impurities that are not contained in or thechannel region 110 and/or a region immediately below the channel region110. In some embodiments, the first stressor 121 contains dopants orimpurities that may be contained in the channel region 110 and/or thesource region 141 but with a much lower concentration than theconcentration of the dopants or impurities contained in the firststressor 121.

According to some embodiments, the dopants or impurities contained inthe first stressor 121 are one or more elements from the groupconsisting of helium (He), neon (Ne), and gallium (Ga), which areimplanted, for example, by focused ion beam (FIB). In some embodiments,the channel region 110 and/or the source region 141 are not doped withany dopants or impurities such as He, Ne, and Ga contained in the firststressor 121.

The lattice constant of the first stressor 121 is increased, compared tothe lattice constant of the same region as the first stressor 121 priorto implanting the dopants or impurities thereto. In a case in which theregion corresponding to the first stressor 121, the channel region 110,and the region immediately below the channel region 110 have the samelattice constant prior to implanting the dopants or impurities, sincethe first stressor 121 contains the dopants or impurities that are notdoped in the channel region 110, the lattice constant of the firststressor 121 is increased compared to those of the channel region 110and the region immediately below the channel region 110.

Still referring to FIG. 1, the strained channel transistor 10 furtherincludes a second stressor 122 disposed between the channel region 110and the drain region 142. A description of the second stressor 122 andthe drain region 142 can be referred to the above description of thefirst stressor 121 and the source region 141 and therefore will beomitted to avoid redundancy.

As described above, the lattice constant of the first stressor 121 andthe lattice constant of the second stressor 122 are increased comparedto that of a region immediately adjacent thereto, for example, theregions immediately below the channel region 110 and/or the channelregion 110. That is, the lattice of the first and second stressors 121and 122 swells, inducing stress in the transistor 10, in particular inthe channel region 110. Thus, the channel region 110 undergoes acompressive stress generated by the first and second stressors 121 and122 having a relatively greater lattice constant, and in this case, thechannel region 110 is a strained channel region.

The concentration of the dopants or impurities contained in the firstand second stressors 121 and 122 is from about 10¹⁰/cm³ to about10²⁰/cm³ in some embodiments, or is from about 10¹⁵/cm³ to about10²⁰/cm³ in other embodiments. In a case in which the channel region 110is formed in an N-type well and the strained channel transistor 10 is aP-type transistor, if a range of the doped concentration from about10¹⁰/cm³ to about 10²⁰/cm³ or a range of the doped concentration fromabout 10¹⁵/cm³ to about 10²⁰/cm³ is satisfied, a mobility of holes inthe channel region 110 can be increased to allow the strained channeltransistor 10 to operate in a relatively lower voltage, requiring lesspower, but with relatively higher current, and in the meantime, othereffects that may deteriorate the performance of the transistor can besuppressed. Accordingly, such a strained channel transistor 10 canoperate in a relatively higher frequency with less power compared to atransistor having the same structure as the strained channel transistor10 except that no stressors are formed in the regions corresponding tothe first and second stressors 121 and 122.

According to some embodiments, the second stressor 122, positioned atone side of the channel region 110 opposite to the first stressor 121,contains the same dopants or concentration as those contained in thefirst stressor 121. The doped concentrations of the first and secondstressors 121 and 122 can be the same, when a variation due tomanufacturing margins/errors in an implantation process is neglected. Inthis case, the first and second stressors 121 and 122 are positionedsymmetrically in relation to the channel region 110, although thepresent disclosure is not limited thereto.

According to other embodiments, the second stressor 122 can bepositioned at one side of the channel region 110 opposite to the firststressor 121, have dopants or impurities different from those containedin the first stressor 121, and/or have a concentration different fromthat of the first stressor 121. In this case, the first and secondstressors 121 and 122 may be positioned unsymmetrically with respect tothe channel region 110.

In some embodiments, an entire region (e.g., the first portion and thesecond portion) of each of the first and second stressors 121 and 122has a uniform lattice constant. In other embodiments, the latticeconstant in the first portions of the first stressor 121 or the secondstressor 122 is different from the second portions. For example, thelattice constant of the second region may be smaller than the latticeconstant of the first region.

In a case in which FIB is implemented to implant the dopants orimpurities to form the first and second stressors 121 and 122, the firstand second stressors 121 and 122 of the strained channel transistor 10can be formed one after another, and the locations, sizes, types ofdopants or impurities, and/or concentrations thereof thus can becontrolled independently.

Still referring to FIG. 1, the strained channel transistor 10 furtherincludes a source contact 161 formed over the source region 141 andelectrically connected thereto, a drain contact 162 formed over thedrain region 142 and electrically connected thereto, and a gate contact163 formed over the gate electrode 135 and electrically connectedthereto. The source contact 161, the drain contact 162, and the gatecontact 163 each penetrate through a dielectric layer 150 over thesubstrate 100 and are electrically isolated from each other by thedielectric layer 150.

Although FIG. 1 shows that a configuration in which the channel region110 made of a fin structure protrudes from the substrate 100 and thesource and drain regions 141 and 142, together with the first and secondstressors 121 and 122, are embedded in the substrate 100, it should beappreciated that such a configuration is an example for description andthe present discourse is not limited thereto. Alternatively, the sourceand drain regions 141 and 142, together with the first and secondstressors 121 and 122 and the channel region 110, can be modified to beformed in the same fin structure protruding from the substrate 100. Itis understood that strained channel transistor 10, as shown in FIG. 1 isnot necessarily a FinFET device and the shown protruded structure (e.g.,fin) is intended to increase a length of the depleted channel region,According to other embodiments, the upper surface of the channel region110 may be positioned to be flush to the other portion of the substrate100, and in this case, the channel region 110 can be modified to notprotrude from the substrate 100, similar to the source and drain regions141 and 142 and the first and second stressors 121 and 122. However, ifthe device is a Fin FET device, the source and drain regions 141 and 142are created over the fin structure on both sides of the gate structurein the Y direction, instead of the X direction shown in FIG. 1.

FIG. 2 is a schematic cross-sectional view of a strained channeltransistor 20 according to embodiments of the present disclosure.

Referring to FIG. 2, a strained channel transistor 20 according toembodiments of the present disclosure has a structure substantially thesame as that of the aforementioned strained channel transistor 10 shownin FIG. 1, except that in the strained channel transistor 20, a stressor123 is disposed below a channel region 110 and somewhat overlaps withthe channel region 110 in a thickness direction of a substrate 100. Thestressor 123 is a graded nano-stressor (e.g., smaller than about 10 nm)which is made using a graded sacrificial layer and without changing theaccelerating voltage of the FIB, as will be discussed further below. Thestressor 123 includes a top structure that approximately matches the finstructure of the channel region 110. The geometric structure of thestressor 123 in not limited to the structure shown in FIG. 2 and canhave other geometric shapes, in some embodiments. In addition, in a casein which the strained channel transistor 10 is one type of a P-typetransistor and an N-type transistor, the strained channel transistor 20is configured to be the other type. One of ordinary skill in the artwould recognize that the strained channel transistors 10 and 20 can beintegrated into a same chip.

It should be appreciated that the aforementioned modifications to thestrained channel transistor 10 are also applicable to the strainedchannel transistor 20 shown in FIG. 2. A description of those elementshaving the same reference numbers as those in FIG. 1 can be referred tothe above description with reference to FIG. 1 and therefore will beomitted to avoid redundancy.

As shown in FIG. 2, the strained channel transistor 20 only includes thesingle contiguously formed stressor 123. Description of the types ofdopants or impurities for forming the stressor 123, ranges of thedopants or impurities, and a process for forming the stressor 123 can bereferred to the description of the first stressor 121 and/or the secondstressor 122 with reference to FIG. 1, and will be omitted here. It isunderstood that strained channel transistor 20, as shown in FIG. 2 isnot a necessarily FinFET device and the shown protruded structure (e.g.,fin) is intended to increase a length of the depleted channel region,According to some embodiments, the upper surface of the channel region110 may be positioned to be flush to the other portion of the substrate100, and in this case, the channel region 110 can be modified to notprotrude from the substrate 100, similar to the source and drain regions141 and 142 and the first and second stressors 121 and 122. However, ifthe device is a Fin FET device, the source and drain regions 141 and 142are created over the fin structure on both sides of the gate structurein the Y direction, instead of the X direction shown in FIG. 2.

The lattice constant of the stressor 123 is increased compared to thatof the channel region 110 and compared to the same region as thestressor 123 prior to the implantation. That is, the lattice of thestressor swells, inducing stress in the transistor 20, in particular inthe region immediately adjacent thereto including the channel region110. The channel region 110 therefore undergoes a tensile stressgenerated by the stressor 123. The stressor 123 has a relatively greaterlattice constant than the region immediately adjacent thereto includingthe channel region 110, and thus, the channel region 110 is a strainedchannel region.

In a case in which the channel region 110 is formed in a P-type well andthe strained channel transistor 20 is an N-type transistor, if theaforementioned ranges of doped concentration are satisfied, inparticularly the range from about 10¹⁵/cm³ to about 10²⁰/cm³ issatisfied, a mobility of electrons in the channel region 110 can beincreased to allow the strained channel transistor 20 to operate in arelatively lower voltage, requiring less power, but with relativelyhigher current, while other effects that may deteriorate the performanceof the transistor can be suppressed. Such a strained channel transistor20 can operate in a relatively higher frequency with less power comparedto a transistor having the same structure as the strained channeltransistor 20 except that no stressor is formed.

Although not shown, in a case in which two or more strained channeltransistors 20 are formed in a same chip made from the substrate 100,when FIB is implemented to implant the dopants or impurities to form thetwo or more strained channel transistors 20, the stressors 123 of thetwo or more strained channel transistors 20 can be formed one afteranother, and the locations and sizes of the stressors 123 in relation tothe respective channel regions, types of dopants or impurities, and/orconcentrations thereof can be controlled independently according todesign particulars.

A method for implanting dopants or impurities into a region of interest,for example, a region corresponding to either the first stressor 121 orthe second stressor 122 shown in FIG. 1 or the stressor 123 shown inFIG. 2, in a substrate, will be described with reference to FIGS. 3A to3C.

FIGS. 3A to 3B are conceptual views of implanting dopants or impuritiesat desired depths into a region of interest in a substrate according toembodiments of the present disclosure. The doped regions can be made atdifferent depths by using ion implantation, without changing anaccelerating voltage of the FIB, by employing a graded sacrificiallayer.

Referring to FIG. 3A, a sacrificial layer 310 is deposited over asubstrate 300. The semiconductor substrate 300 can be, for example, asilicon (Si) substrate, a germanium (Ge) substrate, a silicon germanium(SiGe) substrate, a gallium arsenide (GaAs) substrate, an indium galliumarsenide (InGaAs) substrate, or a silicon-on-insulator (SOI) substrate.The semiconductor substrate 300 can be any other substrates that aresuitable to manufacture semiconductor devices. The sacrificial layer 310can be a silicon oxide (SiO_(x)) or a silicon nitride (SiN_(y)) materialor any material that can be readily fabricated from Silicon, in someembodiments. The sacrificial layer 310 may be formed using any suitabledeposition method such as chemical vapor deposition (CVD), physicalvapor deposition (PVD), atomic layer deposition ALD, or other depositionmethods.

Referring to FIG. 3B, the sacrificial layer 310 is patterned using knownmethods, such as by a photolithography process followed by dry etchingprocess or a wet etching process, to create a recessed region 320therein. In some embodiments, the thickness of the sacrificial layer 310including the recessed region 320 may be within a range of about 1 nm to1000 nm. In some embodiments, the depth of the recessed region 320 maybe within a range of 5% to 95% of the thickness of the sacrificial layer310. In some embodiments, multiple recessed regions with different depthand at desired position along the X direction in the sacrificial layer310 can be formed to allow creation of multiple graded stressors atvarious depths with respect to the top surface of the substrate 300. Therecessed regions facilitate formation of the stressor at various depthsas discussed below.

Referring to FIG. 3C, an ion beam is directly applied to form a gradedstressor which can be in a nano-scale in the semiconductor substrate300. The stressor, as shown in FIG. 3C may have multiple (e.g., three)regions with different depth with respect to a top surface of thesubstrate 300. The depth of different regions of the stressor depends onthe thickness of the sacrificial layer 310 above that region. Thethinner the graded sacrificial layer over a region of the substrate 300,the deeper the formation of the stressor in that region. The depth ofthe stressor from the surface in the substrate may be changed by varyingthe accelerating voltage of the ion beam used to form the strainer or byvarying the thickness of sacrificial layer, as disclosed herein. Theproblem with changing accelerating voltage of the ion beam is that thethroughput can be delayed because of the machine stabilization time.That is because, after each change in the accelerating voltage of theion beam, the process has to go through a pause for the machine tostabilize. The subject technology allows using the graded sacrificiallayer to achieve depositing different portion of a stressor at differentdepth from the surface of the substrate. The stressor is formed byimplantation via an ion beam that can be used to adjust the latticeconstants of adjacent regions.

In some embodiments, the stressor formed, for example by an ion beam,can be shrunk to sub 10-nanometer. In this manner, the stressor is anano-stressor. The lateral location of the stressor can be preciselycontrolled and formed directly due to an extremely small size of an ionbeam. In some embodiments, as shown in FIG. 3C, no ion implantation maskis required to form stressors by an ion beam. The direct writing of astressor, for example, by an ion beam instead of other fabricationprocesses including photography, can be relatively easier to manufacturea stressor at a desired location with a desired doped concentration at arelatively lower manufacturing cost. In other embodiments, ionimplantation mask can be formed to determine lateral locations of thestressors. In those cases, the mask layer can be deposited and patternedprior to formation of the sacrificial layer 310.

In some embodiments, ions, such as He, Ne, and Ga, are implanted to aspecific region by an ion beam to form a stressor. In other embodiments,boron (B) or phosphorus (P) beam, rather than He, Ne, or Ga beam, can beused for directly forming a stressor. In some embodiments, the ion beamis a focused ion beam (FIB).

A thermal annealing process can be performed after ion writing (ordirect ion implantation) and thus, damage and defects caused by ionimplantation can be annihilated. The thermal annealing process can be arapid thermal annealing (RTA), microwave annealing (MWA), laser anneal,etc. In some embodiments, the annealing temperature can be from about50° C. to about 1300° C. In other embodiments, the annealing temperatureis from about 600° C. to about 800° C. The ramp rate can be about 0.1°C./s to about 1000° C./s in some embodiments. The duration of thermalannealing is from about 1 second to about 24 hours in some embodiments.

The stressor is a region, a lattice of which swells by ion implantationfollowed by an optional annealing process. Ion beam writing/lithographycan not only control the size of ion beam, but also the dosage of ionsso as to adjust the amount of stress to the adjacent regions. Thedosage, size, shape, depth, location, etc. of the stressor can becontrolled, for example, by an acceleration voltage of ions, current ofions, an incident angle of ions, etc. In some embodiments, theacceleration voltage of ions can be about 0.1 KeV to about 1000 KeV. Inother embodiments, the acceleration voltage of ions is about 1 KeV toabout 50 KeV. In some embodiments, the current of ions is from about 1fA to about 1 mA. In other embodiments, the current of ions is fromabout 1 pA to about 1 μA. In some embodiments, the incident angle ofions, an angle θ between incident ion current and a normal of thesubstrate, is from about 0.01° to about 179.99°. In other embodiments,the incident angle θ of ion current is from about 45° to about 135°. Inthe embodiments of FIG. 3C, control of the depth of different regions ofthe stressor with respect to the surface of the substrate 300 isarchived by using the graded sacrificial layer 310, instead of changingaccelerating voltage of the ion beams. The thicker portions of thesacrificial layer 310 further reduce the stopping range of theimplantation ions within the substrate. In some embodiments, the gradedsacrificial layer 310 can have other recessed regions with differentdepths when forming of multiple stressors at various depth of thesubstrate are desired.

In some embodiments, the sacrificial layer 310 includes two or morelayer made of different materials. For example, the sacrificial layer310 includes a first layer and a second layer disposed on the firstlayer, and the second layer is pattered to have the recessed region 320.By adjusting the thickness of the first and second layers, it ispossible to control the profile of the stressor.

Referring to FIG. 4, which shows an exemplary structure of a stressormanufactured by a method according to embodiments of the presentdisclosure and dimensions of the exemplary structure, a shape of astressor can be a rectangular cuboid. Each of a width W, a length L, anda height H of the rectangular cuboid ranges from about 1 nm to about 10⁵nm and a ratio between two of the width W, length L, and height H rangesfrom about 10⁻⁵ to about 10⁵, although the present disclosure is notlimited thereto.

A rectangular-cuboid-shaped stressor shown in FIG. 4 is merely anexample; the stressor according to embodiments of the presentdisclosure, however, can have other shapes including, but not limitedto, a cubic shape, an ovoid shape, a tetrahedron shape, a hexagonalprism, etc. In some embodiments, any other shape can be obtained bydirect writing via ion beam. In some embodiments, different stressorregions with different shapes and dimensions can also be created withoutchanging the accelerating voltage of the implantation ions.

FIGS. 5A to 5J are process stages illustrating a process flow formanufacturing the strained channel transistor shown in FIG. 1, accordingto embodiments of the present disclosure.

Referring to FIG. 5A, a substrate 100, which can be one of a silicon(Si) substrate, a germanium (Ge) substrate, a silicon germanium (SiGe)substrate, a gallium arsenide (GaAs) substrate, an indium galliumarsenide (InGaAs) substrate, a silicon-on-insulator (SOI) substrate, andany other semiconductor substrate, is prepared.

As shown in FIG. 5B, a fin structure, a portion of which becomes achannel region 110, is formed on the substrate 100 such that the finstructure protrudes from the substrate 100. The fin structure can beformed, for example, by a portion of the substrate 100 when portions ofthe substrate 100 on opposite sides of the fin structure are removed bya photolithography process followed by a dry etching process or a wetetching process. Thus, the remained top portion of the substrate 100becomes the fin structure.

In a case in which the substrate 100 is an SOI substrate, the finstructure can be formed of a device layer of SOI substrate by removingportions of the device layer.

Alternatively, the channel region 110 can be formed by epitaxiallygrowing a semiconductor layer including, but not limited to, acrystalline silicon layer or a crystalline silicon germanium layer, onthe substrate 100 followed by a photolithography process and a dryetching process or a wet etching process. Accordingly, the remainingportion of the epitaxially grown layer becomes the fin structure on thesubstrate 100. Optionally, one or more buffer layers (not shown) may begrown on the substrate 100 prior to epitaxially growing thesemiconductor layer so as to alleviate interface defects caused, forexample, by lattice mismatch between the epitaxially grown semiconductorlayer and the substrate 100.

Referring to FIG. 5C, a sacrificial layer 115 is formed over thesubstrate and the fin structure. The sacrificial layer 115 can be asilicon oxide (SiO_(x)) or a silicon nitride (SiN_(y)) material or anymaterial that can be readily fabricated from Silicon, in someembodiments. The sacrificial layer 310 may be formed using any suitabledeposition method such as chemical vapor deposition (CVD), physicalvapor deposition (PVD), atomic layer deposition ALD, or other depositionmethods.

Referring to FIG. 5D, the sacrificial layer 310 is patterned using knownmethods, such as by a photolithography process followed by dry etchingprocess or a wet etching process, to create step regions 116 on bothsides of the fin structure. In some embodiments, various thicknesses ofthe graded sacrificial layer including the step regions 116 may bewithin a range of about 0.1 nm to 1000 nm. In some embodiments, the samethicknesses can be within a range of about 5 nm to 500 nm.

Referring to FIG. 5E, first and second stressors 121 and 122 are formedby implanting one or more from the group consisting of helium (He), neon(Ne), and gallium (Ga). In some embodiments, the implantation can be viaan ion beam so as to adjust lattice constants of the regionscorresponding to the first and second stressors 121 and 122 in relationto the regions immediately adjacent thereto and the channel region 110.In this case, the channel region 110 undergoes a compressive stressgenerated by the first and second stressors 121 and 122 having arelatively greater lattice constant than that of the channel region 110.The compressive stress created by the each of the stressors 121 and 122can be a graded compressive stress because it has values that vary bydepth, the same as the stressor regions that are graded in that sense.In some embodiments, the ion beam can be a focused ion beam (FIB). Inother embodiments, a boron (B) or phosphorus (P) beam, rather than a He,Ne, or Ga beam, can be used to form the first and second stressors 121and 122.

In a case in which an ion beam or a focused ion beam is used to form thefirst and second stressors 121 and 122, the first and second stressors121 and 122 can be formed one after another, i.e., not simultaneously.The size, for example, a diameter when the shape is a sphere or a sidelength when the shape is a cubic, of the first and second stressors canbe shrunk to sub 10-nanometer, depending on design particulars. The sizeand the location of the first and second stressors 121 and 122 can beprecisely controlled due to extremely small size of the ion beam. Insome embodiments, no ion implantation mask is required to directly formthe first and second stressors 121 and 122 by the ion beam. The directwriting process by the ion beam instead of other fabrication processesincluding photo-lithography can be easier to manufacture a stressor at adesired location with a desired doped concentration at a relativelylower manufacturing cost. The depth of different regions of thestressors 121 and 122 is controlled by the thickness of the sacrificiallayer above the regions. For example, in the regions of the stressors121 and 122 that are under the step regions 116 of the sacrificiallayer, the ion beam loses more of its energy in the sacrificial layerand has a shorter stopping range in the substrate. Whereas, for theregions of the stressors 121 and 122 that are not under the step regions116 of the sacrificial layer, the ion beam loses less of its energy inthe sacrificial layer and has a longer stopping range in the substrateand the stressor in that region in created in a higher depth.

In other embodiments, an ion implantation mask can be optionally formedto determine lateral locations of the stressors. The ion implantationmask can be formed before deposition of the sacrificial layer 115.

The dosage, size, shape, depth, location, etc. of the first and secondstressors 121 and 122 can be controlled, for example, by an accelerationvoltage of ions, current of ions, an incident angle of ions, etc. Insome embodiments, the acceleration voltage of ion can be about 0.1 KeVto about 1000 KeV. In other embodiments, the acceleration voltage ofions is about 1 KeV to about 50 KeV. In some embodiments, the current ofion is from about 1 fA to about 1 mA. In other embodiments, the currentof ions is from about 1 pA to about 1 μA. In some embodiments, theincident angle of ions, an angle θ between incident ion current and anormal of the substrate, is from about 0.01° to about 179.99°. In otherembodiments, the incident angle θ of ion current is from about 45° toabout 135°. The subject technology allows using the graded sacrificiallayer to achieve depositing different portion of a stressor at differentdepth from the surface of the substrate. In the embodiment of FIG. 5E,for example, the depth of different portion of the stressors 121 and 122are controlled by using the graded sacrificial layer instead of varyingan accelerating voltage of the ion implantation beam.

After implantation, a thermal annealing process can be optionallyperformed and thus, damage and defects caused by ion implantation can beannihilated. The thermal annealing process can be a rapid thermalannealing (RTA), microwave annealing (MWA), laser anneal, etc. In someembodiments, the annealing temperature can be from about 50° C. to about1300° C. In other embodiments, the annealing temperature is from about600° C. to about 800° C. The ramp rate can be about 0.1° C./s to about1000° C./s in some embodiments. The duration of thermal annealing isfrom about 1 second to about 24 hours in some embodiments.

Referring to FIG. 5F, the sacrificial layer 115 including the stepregions 116 are removed by an etch process such as a dry etch or a wetetch process.

Referring to FIG. 5G, a gate structure including a gate insulating layer131 and a gate electrode 135 is formed to cover the channel region 110including side surfaces thereof and a top surface thereof connecting theside surfaces.

Referring to FIG. 5H, source and drain regions 141 and 142 are formed byimplantation, which can be another technique other than the ion beam orthe focused ion beam used to form the first and second stressors 121 and122. Before the implantation process for forming the source and drainregions 141 and 142, an implantation mask (not shown) can be formedfirst to define the locations of the source and drain regions 141 and142. Ions in the process shown in FIG. 5H may be applied to the entiresurface of the substrate 100 but selectively implanted in the regions,defined by the implantation mask (not shown) corresponding to the sourceand drain regions, to form the source and drain regions 141 and 142. Inthis regard, the source and drain regions 141 and 142, unlike the firstand second stressors, are formed simultaneously.

Thereafter, as shown in FIG. 5I, one or more intermediate dielectriclayers 150 are formed to cover the surface of the substrate 100 and thesurface of the structure including the gate electrode layer 135 and thesource and drain regions 141 and 142.

Then, as shown in FIG. 5J, a source contact 161, a drain contact 162,and a gate contact 163, each penetrating through the one or moreintermediate dielectric layers 150, are formed to electrically connectto the source region 141, the drain region 142, and the gate electrodelayer 135, respectively. Accordingly, the strain channel transistor 10shown in FIG. 1 is formed.

FIGS. 6A to 6F are process stages illustrating a process flow formanufacturing the strained channel transistor shown in FIG. 2, accordingto embodiments of the present disclosure.

To avoid redundancy, FIGS. 6A to 6F only shows an implantation by an ionbeam or a focused ion beam to make a stressor and the remainingprocesses to complete a device can be referred to the description withreference to FIGS. 5G to 5J.

Referring to FIGS. 6A to 6C, the process stages of forming the substrate100, the fin structure for channel region 110, and the formation of thesacrificial layer 115 (FIG. 6C) are similar to the process stages shownin FIGS. 5A to 5C, and are not repeated here to prevent redundancy.

Referring to FIG. 6D, the sacrificial layer 115 is patterned usingphoto-lithography and an etch method such as a wet etch process or a dryetch process to create a protruding structure 118 on the top portion ofthe sacrificial layer 115 covering the fin structure.

Referring to FIG. 6E, a stressor 123 can be formed in a similar manneras the first and second stressors shown in FIG. 5E. The stressor 123 isa graded nano-stressor (e.g., smaller than about 10 nm) which is madeusing the graded sacrificial layer and without changing the acceleratingvoltage of the ion beam. The stressor 123 includes a top structure thatapproximately matches the fin structure of the channel region 110 and iscreated at a lower depth (from a top surface of the substrate 100) dueto the protruding structure 118 that reduces the range of ions in thefin structure that is under the protruding structure 118. The geometricstructure of the stressor 123 in not limited to the structure shown inFIG. 6E and can have other geometric shapes, in some embodiments. Thestressor 123 has a relatively greater lattice constant than the regionimmediately adjacent thereto including the channel region 110.Accordingly, a channel region 110 undergoes a tensile stress generatedby the stressor 123 below the channel region 110 in a thicknessdirection of a substrate 100. The tensile stress created by the each ofthe stressor 123 can be a graded tensile stress because it has valuesthat vary by depth, the same as the stressor regions that are graded inthat sense. Other description can be referred to that with reference toFIG. 5E and will be omitted to avoid redundancy.

Referring to FIG. 6F, the sacrificial layer including the protrudingstructure 118 are removed using an etch process such as a wet etch or adry etch process.

By the processes shown in FIGS. 6A to 6F, together with those shown inFIGS. 5G to 5J, the strained channel transistor 20 shown in FIG. 2 isformed.

As described above, the process stages for manufacturing a stressoraccording to embodiments of the present disclosure shown in FIGS. 3A to3C can be implemented to manufacture a semiconductor chip includingstrained channel transistors. The present disclosure is not limitedthereto. Hereinafter, a method including the process for manufacturing astressor will be described with reference to FIGS. 7A to 7F.

FIGS. 7A to 7F are process stages illustrating a process flow formanufacturing multiple semiconductor nanowires (NWs) according toembodiments of the present disclosure.

First, as shown in FIG. 7A, a hard masking layer 205 such as an oxidelayer is formed on a semiconductor substrate 200 and patterned to formopenings 202 and 204. The semiconductor substrate 200 can be a silicon(111) substrate and the hard masking layer 205 can be a silicon oxidelayer formed by thermal oxidation, although the present disclosureshould not limited thereto. In a case the hard masking layer 205 is asilicon oxide layer, the thickness of the silicon oxide layer can befrom 10 nm to 50 nm.

Referring to FIG. 7B, a sacrificial layer 206 is formed and patterned asdescribed with respect to FIGS. 3A to 3B. The detail of the depositionand patterning process is not repeated to prevent redundancy.

Referring to FIG. 7C, first and second stressors 212 and 214 are formedby implanting one or more from the group consisting of helium (He), neon(Ne), and gallium (Ga). In some embodiments, the implantation can be viaan ion beam so as to adjust lattice constants of the regionscorresponding to the first and second stressors 212 and 214 in relationto the regions immediately adjacent thereto. In this case, the regionsimmediately adjacent to the first and second stressors 212 and 214, suchas below the openings 202 and 204 of the mask 205, undergoes acompressive stress generated by the first and second stressors 212 and214 having a relatively greater lattice constants. In some embodiments,the ion beam can be a focused ion beam (FIB). In other embodiments, aboron (B) or phosphorus (P) beam, rather than a He, Ne, or Ga beam, canbe used to form the first and second stressors 212 and 214.

In a case in which an ion beam or a focused ion beam is used to form thefirst and second stressors 212 and 214, the first and second stressors212 and 214 can be formed one after another, i.e., not simultaneously.In some embodiments, the number of stressors is not limited to twostressors and more than two stressors with different dimensions and atdifferent depths with respect to the top surface of the substrate can beformed. The size, for example, a diameter when the shape is a sphere ora side length when the shape is a cubic, of the first and secondstressors can be shrunk to sub 10-nanometer, depending on designparticulars. The size and the location of the first and second stressors212 and 214 can be precisely controlled due to extremely small size ofthe ion beam.

In some embodiments, the hard masking layer 205 is not patterned priorto formation of the sacrificial layer 206. In those embodiments, themasking layer 205 can be patterned by ion beam milling/writing orfocused ion beam (FIB) milling/writing. That is, ions ordopants/impurities are implanted into the semiconductor substrate 200such that the stressors 212 and 214 are formed inside the substrate 200where the ions or dopants/impurities settle, similar to the processshown in FIG. 5E or FIG. 6E.

An accelerating voltage of about 0.1 KeV to about 1000 KeV or about 1KeV to about 50 KeV can be used to generate ion current. The ion beammilling can be configured to have a spot mode in which ions bombard at asingle point or a circle mode in which ions bombard in an area definedby a circle. A spot size of the focused ion beam (FIB) for the spot modeand/or the circle mode is from about 0.5 nm to about 10 nm in someembodiments. The exposure dosage for the circle mode can be from 5nC/μm² to 25 nC/μm² and the exposure dosage for the spot mode can befrom 1.5 pC to 8 pC in some embodiments. The formation of the stressors212 and 214 having, for example, a rounded cylinder or an oval-shapedball under the openings 202 and 204 simultaneously accompanies theformation of openings 202 and 204 in the hard masking layer 205. In someembodiments, ions are selected from the group consisting of He, Ne, andGa.

Optionally, a thermal annealing process can be performed after ionwriting, damage and defects caused by ion implantation can beannihilated. The thermal annealing process can be a rapid thermalannealing (RTA), microwave annealing (MWA), laser anneal, etc. In someembodiments, the annealing temperature can be from about 50° C. to about1300° C. In other embodiments, the annealing temperature is from about600° C. to about 800° C. The ramp rate can be about 0.1° C./s to about1000° C./s in some embodiments. The duration of thermal annealing isfrom about 1 second to about 24 hours in some embodiments. In someembodiments, the thermal annealing can be performed after thesacrificial layer 206 is removed, as seen in FIG. 7D. The removal of thesacrificial layer can be done using a wet or dry etch process.

To ensure effective growth of semiconductor nanowires, a surfacetreatment process, such as a dry etching or a wet etching, to remove theresidue of the hard masking layer material in the region bombarded bythe ion beam, can be optionally performed with reference to FIG. 7D. Ina case in which the hard masking layer 205 is a silicon oxide layerformed by thermal oxidizing the substrate 200 formed of silicon, theresidue of silicon oxide in the portion bombarded by the ion beam can beremoved by dipping in a dilute HF solution.

Referring to FIG. 7E, semiconductor nanowires 220 and 230 are grown fromthe exposed portion of the substrate 200 by, for example, molecular beamepitaxy (MBE), although the present disclosure is not limited thereto.In a case in which the substrate 200 is a silicon (111) substrate, thehard masking layer 205 is a silicon oxide layer, and He ions areimplanted by a focused ion beam to form the stressor 210 in thesubstrate 200, an InAs nanowire can be grown from the exposed portion ofthe substrate 200. In a case the silicon oxide layer is completelyremoved at the region bombarded, by the He ion beam and/or a dippingprocess in the diluted HF solution, the InAs nanowire can be directlyformed on the exposed silicon substrate 200. Indium beam and As₂ beamfor forming the InAs nanowire can come from effusion cells. The growthtemperature can be from 400° C. to 600° C. In other embodiments, GaAsnanowires can be formed in a similar manner as the InAs nanowires. Therange of the growth temperature of the GaAs nanowires can be from about400° C. to about 700° C. in some embodiments.

Referring to FIG. 7F, the masking layer 205 is removed using, forexample, a dry etch process.

Due to the stressors 212 and 214 in the substrate 200, the latticeconstant in the region of the stressors 212 and 214 increases, causingthe lattice constant of the region adjacent thereto to increaseslightly, as evidenced by FIGS. 8A to 8C which show transmissionelectron microscopy (TEM) images of an InAs nanowire formed on a silicon(111) substrate having a He stressor therein. FIG. 8B shows the image R1of a region of the stressor and a corresponding higher resolution imageR3. The TEM image shows a stressor with a swelled lattice constant ofabout 5.546 Å, which is higher than a lattice constant of about 5.431 Åof silicon. Since the lattice mismatch at an interface between thesilicon substrate and the InAs nanowire grown thereon can be reduced byforming the He stressor in the silicon substrate, formation of thevertically grown InAs nanowire can be promoted and a yield can beimproved. FIG. 8C shows an image of the interface region R2 and acorresponding higher resolution image R4 that shows a lattice constantof about 5.517 Å, which is higher than the lattice constant of silicon,due to the formation of the stressor.

According to some aspects of the present disclosure, ion beam or focusedion beam, selected from the group consisting of He, Ne, and Ga, can bedirectly and precisely applied to a substrate to form a stressortherein. No implantation mask may be required to form the stressor.Lattice constants in the region of the stressor and the region adjacentto the stressor can be modulated depending on the size, location, anddoped concentration of the stressor. The subject technology uses agraded sacrificial layer to control the depths of various portions ofthe stressors in the substrate, instead of changing an acceleratingvoltage of the beam, to prevent delayed throughput that can be caused bychanging an accelerating voltage of the beam.

According to some aspects of the present disclosure, in a case in whichone or more stressors are implemented into a transistor, a channelregion of the transistor can be biased by either a compressive stress ora tensile stress, and accordingly, electron mobility or hole mobilitycan be improved. The transistor can thus operate at a relatively highfrequency with relatively lower power consumption. According to someaspects of the present disclosure, a semiconductor device includes asemiconductor fin protruding from a substrate. The semiconductor devicefurther includes a gate electrode disposed over the semiconductor fin. Agate insulating layer is disposed between the semiconductor fin and thegate electrode. Source and drain regions are disposed on opposite sidesof the semiconductor fin, and a first stressor is formed in a region ofthe substrate between the source and drain regions or in a region of thesemiconductor fin between the source and drain regions. The firststressor is a grading strained stressor including multiple gradedportions formed at graded depths, and the first stressor is configuredto create one of a graded compressive stress or a graded tensile stress.

According to some aspects of the present disclosure, a method formanufacturing a semiconductor device includes forming a semiconductorfin on a substrate. The method further includes depositing andpatterning a graded sacrificial layer over the substrate. a firststressor is implanted in the substrate by using an ion beam through thegraded sacrificial layer. The graded sacrificial layer is then removed.A gate insulating layer is deposited and patterned to cover thesemiconductor fi. A gate electrode layer is formed to cover the gateinsulating layer. Source and drain electrodes are formed on oppositesides of the semiconductor fin.

According to some aspects of the present disclosure, a method forforming multiple nanowires on a semiconductor substrate includes forminga patterned mask layer including multiple trenches over thesemiconductor substrate. The method further includes forming a gradedsacrificial layer over the mask layer including the multiple trenches.Ion current is applied on a region of the graded sacrificial layerincluding the multiple openings, such that ions of the ion currentbombard the region of graded sacrificial layer to settle at differentdepths in regions in the semiconductor substrate to form multiplestressors at the different depths. The multiple nanowires are grown onportions of the semiconductor substrate exposed by the multiple openingsof the patterned mask layer.

In accordance with one aspect of the present disclosure, a semiconductordevice includes a semiconductor fin protruding from a substrate; a gateelectrode disposed over the semiconductor fin; a gate insulating layerdisposed between the semiconductor fin and the gate electrode; sourceand drain regions disposed on opposite sides of the semiconductor fin;and a first stressor formed in a region of the substrate between thesource and drain regions or in a region of the semiconductor fin betweenthe source and drain regions. The first stressor is a grading strainedstressor including multiple graded portions formed at graded depths, andthe first stressor is configured to create one of a graded compressivestress or a graded tensile stress. In one or more of the foregoing orfollowing embodiments, the first stressor comprises a nano-stressor, thefirst stressor includes one material selected from the group consistingof He, Ne, and Ga, and a lattice constant of the first stressor isgreater than that of a region immedicably adjacent to the firststressor. In one or more of the foregoing or following embodiments, thefirst stressor is disposed under a central region of the semiconductorfin, and the first stressor is only stressor disposed between the sourceand drain regions, and the first stressor is configured to create thegraded tensile stress. In one or more of the foregoing or followingembodiments, the semiconductor device includes a second stressor, andthe first and second stressors have similar structures and are disposedon opposite sides of the semiconductor fin and between the source anddrain regions, and the first and second stressors are configured tocreate the graded compressive stress. In one or more of the foregoing orfollowing embodiments, a material concentration in the first stressor isabout 10¹⁰/cm³ to about 10²⁰/cm³, and the graded depths are within arange of about 1 nm to 100 μm. In one or more of the foregoing orfollowing embodiments, a material concentration in the first stressor isabout 10¹⁵/cm³ to about 10²⁰/cm³, and each portion of the multiplegraded portions has a cross-sectional shape including one of a square, arectangle, an oval, a triangle, or a hexagon. In one or more of theforegoing or following embodiments, the substrate is one selected fromthe group consisting of a Si substrate, a Ge substrate, a SiGesubstrate, a GaAs substrate, and an InGaAs substrate.

In accordance with another aspect of the present disclosure, in a methodfor manufacturing a semiconductor device, a semiconductor fin is formedover a substrate. A graded sacrificial layer is deposited and patternedover the substrate. A first stressor is implanted in the substrate byusing an ion beam through the graded sacrificial layer. The gradedsacrificial layer is removed. A gate insulating layer is deposited andpatterned to cover the semiconductor fin. A gate electrode layer isformed to cover the gate insulating layer. Source and drain electrodesare formed on opposite sides of the semiconductor fin. In one or more ofthe foregoing or following embodiments, the first stressor is formed ofone material selected from the group consisting of He, Ne, and Gaimplanted into the substrate. In one or more of the foregoing orfollowing embodiments, the ion beam is a focused ion beam of one of He,Ne, or Ga, and the graded sacrificial layer comprises SiO_(x) or SiN_(y)and has thicknesses within a range of about 0.1 nm to 1000 nm. In one ormore of the foregoing or following embodiments, forming the firststressor comprises forming a grading strained stressor includingmultiple graded portions at graded depths, and the graded depths followa grading of the graded sacrificial layer. In one or more of theforegoing or following embodiments, a second stressor similar to thefirst stressor is formed on another side of the semiconductor finopposite to the first stressor with respect to the semiconductor fin.The first stressor and the second stressor are implanted at differentangles. In one or more of the foregoing or following embodiments, thegrading strained stressor is capable of creating one of a gradedcompressive stress or a graded tensile stress, and the method furthercomprises performing an annealing process after forming the firststressor. In one or more of the foregoing or following embodiments,forming the first stressor comprises forming a grading strained stressorin a region under a central region of the semiconductor fin. In one ormore of the foregoing or following embodiments, forming the firststressor comprises forming a grading strained stressor on one side ofthe semiconductor fin. Further, a second stressor similar to the firststressor is formed on another side of the semiconductor fin opposite tothe first stressor with respect to the semiconductor fin. In one or moreof the foregoing or following embodiments, the substrate is one selectedfrom the group consisting of a Si substrate, a Ge substrate, a SiGesubstrate, a GaAs substrate, and an InGaAs substrate. In one or more ofthe foregoing or following embodiments, a material concentration in thefirst stressor is about 10¹⁰/cm³ to about 10²⁰/cm³.

In accordance with another aspect of the present disclosure, in a methodfor forming multiple nanowires on a semiconductor substrate, a patternedmask layer including multiple trenches is formed over the semiconductorsubstrate. A graded sacrificial layer is formed over the mask layerincluding the multiple trenches. Ion current is applied on a region ofthe graded sacrificial layer including the multiple openings, such thations of the ion current bombard the region of graded sacrificial layerto settle at different depths in regions in the semiconductor substrateto form multiple stressors at the different depths. The multiplenanowires are grown on portions of the semiconductor substrate exposedby the multiple openings of the patterned mask layer. In one or more ofthe foregoing or following embodiments, the ions are one selected fromthe group consisting of He, Ne, and Ga, and the graded sacrificial layercomprises SiO_(x) or SiN_(y) and has thicknesses within a range of about0.1 nm to 1000 nm. In one or more of the foregoing or followingembodiments, the semiconductor substrate is a silicon substrate, themask layer is a silicon oxide layer, and the nanowire is an InAsnanowire perpendicularly grown on the silicon substrate.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for manufacturing a semiconductordevice, the method comprising: forming a semiconductor fin on asubstrate; depositing and patterning a sacrificial layer over thesubstrate, wherein the sacrificial layer has two or more portions havingdifferent non-zero thicknesses; implanting a first stressor in thesubstrate by using an ion beam through the two or more portions of thesacrificial layer; removing the sacrificial layer; depositing andpatterning a gate insulating layer to cover the semiconductor fin;forming a gate electrode layer to cover the gate insulating layer; andforming source and drain electrodes on opposite sides of thesemiconductor fin.
 2. The method of claim 1, wherein the first stressoris formed of one material selected from the group consisting of He, Ne,and Ga implanted into the substrate.
 3. The method of claim 1, wherein:the sacrificial layer comprises SiO_(x) or SiN_(y) and has thicknesseswithin a range of 0.1 nm to 1000 nm.
 4. The method of claim 1, wherein:forming the first stressor comprises forming a grading strained stressorincluding multiple graded portions at graded depths, and the gradeddepths follow a thickness variation of the sacrificial layer.
 5. Themethod of claim 4, further comprising forming a second stressor similarto the first stressor on another side of the semiconductor fin oppositeto the first stressor with respect to the semiconductor fin, wherein thefirst stressor and the second stressor are implanted at differentangles.
 6. The method of claim 4, wherein the grading strained stressoris capable of creating one of a graded compressive stress or a gradedtensile stress, and the method further comprises performing an annealingprocess after forming the first stressor.
 7. The method of claim 1,wherein forming the first stressor comprises forming a grading strainedstressor in a region under a central region of the semiconductor fin. 8.The method of claim 1, wherein forming the first stressor comprisesforming a grading strained stressor on one side of the semiconductorfin, and the method further comprises forming a second stressor similarto the first stressor on another side of the semiconductor fin oppositeto the first stressor with respect to the semiconductor fin.
 9. Themethod of claim 1, wherein the substrate is one selected from the groupconsisting of a Si substrate, a Ge substrate, a SiGe substrate, a GaAssubstrate, and an InGaAs substrate.
 10. The method of claim 1, wherein amaterial concentration in the first stressor is 10¹⁰ atoms/cm³ to 10²⁰atoms/cm³.
 11. The method of claim 1, wherein the ion beam is a focusedion beam of at least one of He, Ne and Ga.
 12. A method formanufacturing a semiconductor device, the method comprising: forming asemiconductor fin on a substrate; depositing and patterning asacrificial layer over the substrate, wherein the sacrificial layer hastwo or more portions having different non-zero thicknesses; forming astressor in the substrate under the semiconductor fin by implanting ionsthrough the two or more portions of the sacrificial layer; removing thesacrificial layer; depositing and patterning a gate insulating layer tocover the semiconductor fin; forming a gate electrode layer to cover thegate insulating layer; and forming source and drain electrodes onopposite sides of the semiconductor fin.
 13. The method of claim 12,wherein the stressor applies tensile stress to a channel.
 14. The methodof claim 12, wherein the ions are helium ions.
 15. The method of claim12, further comprising, after the forming the stressor, performing anannealing operation at a temperature in a range from 600° C. to 800° C.16. The method of claim 12, wherein the sacrificial layer comprisesSiO_(x) or SiN_(y) and has thicknesses within a range of 0.1 nm to 1000nm.
 17. A method for manufacturing a semiconductor device, the methodcomprising: forming a semiconductor fin on a substrate; depositing andpatterning a sacrificial layer over the substrate, wherein thesacrificial layer has two or more portions having different non-zerothicknesses; forming stressors in the substrate at regions laterallyadjacent to the semiconductor fin by implanting ions through the two ormore portions of the sacrificial layer; removing the sacrificial layer;depositing and patterning a gate insulating layer to cover thesemiconductor fin; forming a gate electrode layer to cover the gateinsulating layer; and forming source and drain electrodes on oppositesides of the semiconductor fin.
 18. The method of claim 17, wherein thestressors apply compressive stress to a channel.
 19. The method of claim17, wherein the ions are selected from the group consisting of He ions,Ne ions and Ga ions.
 20. The method of claim 17, further comprising,after the forming the stressors, performing an annealing operation at atemperature in a range from 600° C. to 1300° C.